Cabinet approves four semiconductor projects in Odisha, Punjab and Andhra Pradesh

The Union Cabinet chaired by Prime Minister Narendra Modi has approved four more semiconductor projects under India Semiconductor Mission (ISM). Union Minister for Electronics and IT Ashwini Vaishnaw announced the approval of four new semiconductor projects with a total investment of Rs 4,594 crore which are to be set up in Odisha, Punjab and Andhra Pradesh. This includes two in Odisha and one each in Punjab and Andhra Pradesh.

With these approvals, the total number of ISM-supported semiconductor projects has reached 10, involving investments of about ₹1.60 lakh crore across 6 states.

In Bhubaneswar’s Info Valley, SiCSem Pvt Ltd, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish a Silicon Carbide (SiC) compound semiconductor fabrication unit. The plant will have a capacity of 60,000 wafers and 96 million packaged units annually, producing devices for defence, transport, renewable energy, and consumer electronics.

The second Odisha project, by 3D Glass Solutions Inc., will build an advanced packaging and embedded glass substrate facility with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules. These will be used in computing, defence, automotive, and photonics applications.

In Andhra Pradesh, Advanced System in Package Technologies (ASIP), in partnership with APACT Co, Ltd, South Korea, will set up a plant with an annual capacity of 96 million units. The products will be supplied for mobile devices, set-top boxes, automotive, and other electronics applications.

In Punjab, Continental Device India Ltd (CDIL) will expand its existing discrete semiconductor manufacturing plant in Mohali. The facility will produce MOSFETs, IGBTs, Schottky bypass diodes, and transistors in both silicon and silicon carbide, with an annual capacity of 158.38 million units. The devices will be used in automotive, renewable energy, industrial, and communication systems.