![element14 offers TE Connectivity component solutions element14 offers TE Connectivity component solutions](https://varindia.com/storage/news/uploads/2014/07/element14.jpeg.jpg)
element14 has engaged with TE Connectivity (TE) to offer the most comprehensive component solutions for applications in motion and drives, including controller/PLC systems, drive units, system interfaces, HMI/display and control units, and motor and sensing devices. The broad portfolio of TE products, available through element14, helps save power and reduce applied cost. The products include Dynamic Series wire-applied connectors, Power Triple Lock (PTL) connectors, Free Height (FH) board-to-board connectors, relays, and Remote I/O Terminal System (RITS) connectors.
Customers can use element14’s newly developed microsite to access information on featured products supporting the following applications -
- Controller / PLC system: AMPLIMITE D-subminiature connectors, CHAMP connectors, Eurocard and Z-STACK connectors
- Drive unit: Industrial mini I/O connector system, industrial RJ45 and RITS connectors
- System interface: terminal blocks and strips, universal MATE-N-LOK, Power Triple Lock (PTL) and AMP Power Series wire-applied connectors
- I/O: circular plastic connectors (CPC), heavy duty connectors (HDC), Dynamic Series wire-applied connectors and AMPMODU board-to-board and wire-to-board connectors
- Motor: customized cable assemblies, Motorman hybrid I/O connectors
- Sensing device: M8/M12 connector systems
HB Chua, Vice President, Channel Sales, TE Connectivity Asia said, “We are delighted that our customers can now use element14’s solutions microsite as a great resource to simplify their review and selection of TE products. After choosing the best products for their applications, they can then enjoy fast delivery from element14.”
The “Design Navigator” on the microsite enables customers to quickly identify the specific TE product family they need for their application, based on their unique design requirements and application challenges such as: power and signal combined, protection from EMI/RFI noise, thermal performance, quick connect/disconnect, miniaturization and space savings.
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