Qualcomm brings new features in Snapdragon X70 Modem-RF System

Qualcomm Technologies, Inc. announced at the Qualcomm 5G Summit event new capabilities and milestones for the Snapdragon X70 5G Modem-RF System. These accomplishments build upon the fifth-generation 5G modem-to-antenna solution announced in February at MWC Barcelona. Harnessing the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads, incredible upload speeds, low latency, coverage, and power efficiency, Snapdragon X70 offers ultimate flexibility to global 5G operators to maximize spectrum resources for the best possible 5G connectivity. Snapdragon X70 provides advanced capabilities such as Qualcomm 5G AI Suite, Qualcomm 5G Ultra-Low Latency Suite, Qualcomm 5G PowerSave Gen 3, uplink carrier aggregation, standalone mmWave and 4X sub-6 carrier aggregation to achieve unmatched 5G performance.

“Snapdragon X70 gives operators the ability to deliver extreme 5G capacity, multi-Gigabit data speeds, and new use cases across devices from smartphones to laptops, fixed wireless access equipment, industrial machines, and more,” said Durga Malladi, Senior Vice President and General Manager, Cellular Modems and Infrastructure, Qualcomm Technologies, Inc. “We look forward to working with industry leaders to advance 5G to power best-in-class connectivity experiences at the connected intelligent edge and transform industries across consumer, enterprise and industrial settings.”