Enfabrica sets up R&D Hub in India to drive AI networking innovation

AI networking leader Enfabrica Corporation has announced the opening of its India R&D operation, headquartered in Hyderabad, India. The establishment of its new office and R&D facility in India positions Enfabrica at the center of a technological hub for AI innovation to grow its world-class engineering team and scale silicon and software product development operations. The new office expands the company’s global footprint and underscores its commitment to hire and nurture top talent to deliver the industry’s most advanced networking products for scaling AI infrastructure. 

Enfabrica is redefining networking for AI by building chips and software to efficiently interconnect parallel, heterogeneous and accelerated computing systems like never before. The company’s 3.2 Terabit/second ACF SuperNIC – is built to be the world’s fastest, most resilient, and most scalable GPU network interface controller chip. For clusters spanning 2K GPUs to 100K+ GPUs, it delivers higher performance for popular AI frameworks while simplifying network designs to drive down both capital and operational expenses. 

Enfabrica’s R&D center in Hyderabad is located within a vibrant, academic community of engineers and developers eager to tackle the performance and scalability demands of AI and accelerated computing workloads. This new R&D center will provide opportunities for employees to build solutions tailor-made for the age of Gen AI. 

“Computer technology has always advanced at the speed and capacity set by interconnect and scaling capabilities,” said Shrijeet Mukherjee, Chief Development Officer at Enfabrica. “With technology that represents a big step up in capabilities and performance, Enfabrica is committed to driving and accelerating India's aim to be a key player in the global AI race. There is a tremendous opportunity for expansion in this market and Enfabrica is well positioned to help lead that evolution. We are proud to establish our very own hub in Hyderabad, leveraging the massive Indian talent pool to drive further innovation.”

 Enfabrica recently announced the general availability of its groundbreaking 3.2 Terabit/sec (Tbps) ACF SuperNIC chip and a $115M Series C round to fuel the next stage of growth for Enfabrica. The company is backed by an incredibly strong investor syndicate and has raised a total of $260M.