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Honeywell Presents TIM Solution to keep Phones Cool

Honeywell has announced the availability of a Thermal Interface Materials (TIM) solution to help smartphone manufacturers and designers effectively manage heat dissipation in their phones.


Honeywell’s TIM technology is based on phase change materials (PCMs). The technology transfers thermal energy from phone chips to a heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chips cool, so the phone can perform reliably even during the most data-intense processes or during heat spikes. Honeywell’s solution is available worldwide and is already being used by some of the largest smartphone makers to upgrade the thermal designs of their latest phone models. Customers consistently choose Honeywell’s technology because it provides the best combination of performance and reliability to maximize the lifecycles of their devices, and is optimized to meet new and unexpected challenges.


“Honeywell’s innovative TIM technology provides customers with the ideal solution to optimize their phones’ performances,” said Olivier Biebuyck, vice president and general manager of Honeywell Electronic Materials. “As demand for smartphones grows around the world, these breakthrough designs help provide optimal user experience throughout the entire lifecycle of their devices.”


Honeywell supplies microelectronic polymers, electronic chemicals, and other advanced materials along with an extensive set of product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples, and low alpha emissivity plating anodes and advanced heat spreader materials used during back-end packaging processes for thermal management and electrical interconnect.