Samsung, Intel, Ericsson and IBM co-designing next-gen chips

Samsung, Ericsson, IBM, and Intel are teaming up to research and develop next-generation chips. The US National Science Foundation (NSF) is funding this partnership and has awarded the tech giants $50 million for the project as part of its “Future of Semiconductors” initiative.

The NSF and the four tech giants will work on a “co-design” basis across different fronts to develop the next-gen chips. Samsung, Ericsson, IBM, and Intel will join forces and work hand-in-hand on areas including device performance, chip and system level, recyclability, environmental impact, and manufacturability.

Through the $50 million funding, the NSF aims for this partnership between Samsung, Ericsson, IBM, and Intel to “inform research needs, spur innovation, accelerate the translation of results to the market, and prepare the future workforce.”

This initiative is a part of NSF’s Future of Semiconductors (FuSe) Teaming Grants. Under the program, progress in developing new processes, materials, devices, and architectures has been hindered by independent development. The program sees a great opportunity in advancing computing technologies and reducing their cost of application through co-development.