VIA Extends IoT with new VIA AMOS-3003 Fanless System

VIA Technologies has announced the VIA AMOS-3003, a compact embedded IoT system designed around the tiny VIA EPIA-P910 Pico-ITX board. Combining low power, rich connectivity and high performance 64-bit computing in a ruggedized design, the VIA AMOS-3003 delivers all the latest features and digital media standards required in data collection terminals for in-vehicle control as well as machine to machine controllers in a host of industrial automation applications.
 Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.
 “The proliferation of wireless connectivity to the cloud is opening up exciting new possibilities for capturing more real-time IoT data in order to improve operating efficiency,’ said Epan Wu, Head of VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA AMOS-3003 provides a robust system with wide power input support and flexible connectivity options to enhance the remote collection and processing of this data in the most demanding environments.”
Software solutions packs are available the VIA AMOS-3003 include Microsoft Win7, Win8, and WES7 as well as Linux OS. Customers can also take advantage of VIA’s industry leading hardware and software support, including our SMART ETK (Embedded Tool Kit) to create customized designs with a quick time to market.