Samsung unveils the world's thinnest RAM for AI, measuring just 0.65mm

With a 0.65mm thickness, Samsung has announced the world's thinnest LPDDR5X DRAM chip, designed specifically for smartphones with on-device AI. The new 12nm-class processors provide a 9% thinner design than their predecessors and are available in 12GB and 16GB capacities. Samsung's innovation promises improved performance for next mobile devices; it uses sophisticated PCB and epoxy moulding procedures.

The reduced size of Samsung's new LPDDR5X DRAM chip is not just about aesthetics. According to the tech giant, this decrease in thickness is anticipated to enhance cooling by 21.2%.The development process involved optimizing printed circuit board (PCB) and epoxy molding compound techniques, resulting in a chip as thin as a fingernail. This innovative design approach has led to a product that promises improved performance and efficiency for smartphones with on-device AI capabilities.

The LPDDR5X DRAM chip is uniquely structured, built using a 4-stack layout with each stack consisting of two LPDDR DRAMs. Samsung has already started distributing these new thinner chips to manufacturers. In response to the increasing demand for high-performance, high-density mobile memory solutions, Samsung intends to develop 6-layer 24GB and 8-layer 32GB DRAMs into the thinnest packages for future devices.