Huawei Technologies is aggressively expanding its semiconductor manufacturing facilities in Shenzhen, China, despite stringent US sanctions imposed since 2019 to curb its access to advanced chip technology. Satellite imagery analyzed by the Financial Times reveals rapid development of three manufacturing sites in Shenzhen’s Guanlan district since 2022, signaling Huawei’s drive to achieve semiconductor self-sufficiency and challenge global tech leaders like Nvidia and TSMC.
The facilities, backed by Shenzhen’s government, include a Huawei-operated site for 7-nanometer smartphone and Ascend AI chips, alongside sites run by SiCarrier and SwaySure, which share staff and technology despite Huawei’s denials of affiliation. These efforts align with China’s $47.5 billion “Big Fund” to bolster domestic chip production, countering US export controls.
Huawei’s progress, including its Mate 60 Pro’s 7nm Kirin 9000s chip made by SMIC, showcases its ability to navigate sanctions, though it relies on pre-ban ASML equipment and faces challenges scaling to 5nm.
This expansion reflects a digital-first strategy, reimagining supply chains to reduce foreign dependency, akin to India’s Operation Sindoor leveraging ISRO’s satellite technology for strategic autonomy. Huawei’s moves, supported by state funding and partnerships with firms like SMIC, underscore China’s technological resilience amid geopolitical tensions.
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