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Applied Materials has partnered with leading memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies designed for artificial intelligence and high-performance computing systems.
The companies will collaborate at Applied Materials’ new Equipment and Process Innovation and Commercialization (EPIC) Center, a semiconductor research hub aimed at accelerating development of advanced chip manufacturing technologies.
Applied Materials said the EPIC Center represents a planned $5 billion investment in semiconductor equipment research and development, with spending expected to scale gradually as customer projects expand.
Micron and SK Hynix will act as founding partners at the facility, working with Applied Materials engineers to develop new manufacturing processes and materials for future memory chips.
The partnership with Micron will focus on advancing DRAM, high-bandwidth memory (HBM) and NAND technologies, combining research from Applied Materials’ EPIC Center with Micron’s innovation hub in Boise, Idaho.
Meanwhile, collaboration with SK Hynix will center on improving materials and manufacturing processes for next-generation memory chips, including work on 3D advanced packaging and high-bandwidth memory architectures.
Demand for advanced memory is rising rapidly as major technology companies invest heavily in artificial intelligence infrastructure. Companies such as OpenAI, Google and Microsoft are building large AI data centers that require massive volumes of high-performance memory chips.
Industry analysts estimate global technology companies could spend more than $630 billion on AI infrastructure this year, increasing pressure on memory suppliers.
The surge in demand has already tightened supply across the memory market, with the three largest producers—Samsung Electronics, SK Hynix and Micron—warning that they are struggling to keep pace with orders for advanced AI-related memory components.
Applied Materials first announced plans for the EPIC research center in 2023, initially projecting up to $4 billion in investment and targeting a 2026 launch. The collaboration with Micron and SK Hynix is expected to help accelerate development of next-generation memory technologies needed for AI computing workloads.
The companies will collaborate at Applied Materials’ new Equipment and Process Innovation and Commercialization (EPIC) Center, a semiconductor research hub aimed at accelerating development of advanced chip manufacturing technologies.
Applied Materials said the EPIC Center represents a planned $5 billion investment in semiconductor equipment research and development, with spending expected to scale gradually as customer projects expand.
Micron and SK Hynix will act as founding partners at the facility, working with Applied Materials engineers to develop new manufacturing processes and materials for future memory chips.
The partnership with Micron will focus on advancing DRAM, high-bandwidth memory (HBM) and NAND technologies, combining research from Applied Materials’ EPIC Center with Micron’s innovation hub in Boise, Idaho.
Meanwhile, collaboration with SK Hynix will center on improving materials and manufacturing processes for next-generation memory chips, including work on 3D advanced packaging and high-bandwidth memory architectures.
Demand for advanced memory is rising rapidly as major technology companies invest heavily in artificial intelligence infrastructure. Companies such as OpenAI, Google and Microsoft are building large AI data centers that require massive volumes of high-performance memory chips.
Industry analysts estimate global technology companies could spend more than $630 billion on AI infrastructure this year, increasing pressure on memory suppliers.
The surge in demand has already tightened supply across the memory market, with the three largest producers—Samsung Electronics, SK Hynix and Micron—warning that they are struggling to keep pace with orders for advanced AI-related memory components.
Applied Materials first announced plans for the EPIC research center in 2023, initially projecting up to $4 billion in investment and targeting a 2026 launch. The collaboration with Micron and SK Hynix is expected to help accelerate development of next-generation memory technologies needed for AI computing workloads.
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