Collaboration focuses on next-generation HBM4 memory, advanced DRAM solutions, and integrated AI infrastructure, aiming to enhance performance, efficiency, and scalability across data centers and high-performance computing systems.
Samsung Electronics has signed a Memorandum of Understanding (MoU) with Advanced Micro Devices to expand their long-standing partnership in artificial intelligence (AI) memory and computing technologies. The agreement signals a deeper alignment between the two companies as demand for high-performance AI infrastructure continues to grow.
The signing ceremony took place at Samsung’s semiconductor manufacturing complex in Pyeongtaek, South Korea, with senior leadership from both firms in attendance, including Lisa Su and Young Hyun Jun.
“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”
“Powering the next generation of AI infrastructure requires deep collaboration across the industry,” said Dr. Lisa Su, Chair and CEO of AMD. “We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”
Focus on next-generation AI infrastructure
Under the agreement, the two companies will collaborate on supplying Samsung’s HBM4 memory for AMD’s upcoming AI accelerator, the Instinct MI455X GPU. They will also work together on advanced DRAM solutions tailored for AMD’s next-generation EPYC processors, codenamed “Venice.”
These technologies are expected to power integrated AI systems combining GPUs, CPUs, and rack-scale platforms such as AMD’s Helios architecture. The partnership aims to address growing requirements for memory bandwidth and energy efficiency in data-intensive AI workloads.
Samsung’s HBM4, built on its advanced 10-nanometer-class process and a 4nm logic base die, is designed to deliver high-speed performance and improved efficiency, supporting demanding AI training and inference applications.
Expanding collaboration across memory and foundry
Beyond HBM4, the companies will also jointly develop high-performance DDR5 memory optimized for AMD’s upcoming EPYC CPUs, further strengthening their collaboration in data center solutions.
In addition, Samsung and AMD plan to explore expanded foundry cooperation, with Samsung potentially manufacturing future AMD products using its semiconductor fabrication capabilities.
The latest agreement builds on nearly two decades of collaboration between the two firms across graphics, mobile, and computing technologies. Samsung has previously served as a key partner in supplying advanced memory solutions for AMD’s AI accelerators, reinforcing its role in the evolving AI hardware ecosystem.
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