SanDisk forms Technical Advisory Board to guide high bandwidth flash development for AI Era

SanDisk’s newly formed Technical Advisory Board, chaired by Turing Award winner David Patterson and joined by graphics and AI pioneer Raja Koduri, will guide HBF memory’s development, commercialization, and open standards strategy for the AI era

SanDisk Corporation has announced the formation of a Technical Advisory Board to shape the future of its breakthrough High Bandwidth Flash (HBF) memory technology, aimed at transforming AI inference at both datacenter and edge levels.

The newly formed board includes leading computer architecture experts from within and outside the company. Most notably, Professor David Patterson — a Turing Award-winning computer scientist — will chair the board, while graphics and AI veteran Raja Koduri will also lend his strategic insight. Together, they will provide technical counsel, market guidance, and contribute to open standards development as SanDisk prepares to commercialize HBF.

“We’re honored to have two distinguished computer architecture experts join our Technical Advisory Board,” said Alper Ilkbahar, Executive Vice President and Chief Technology Officer at SanDisk. “Their strategic input will be critical in positioning HBF as a foundational memory standard for the AI industry.”

Professor Patterson, renowned for his pioneering work in RISC architecture, RAID storage, and Networks of Workstations, brings deep academic and industry experience. In addition to his current roles at UC Berkeley and Google, he co-authored the definitive textbook Computer Architecture: A Quantitative Approach and was awarded the ACM Turing Award in 2017. Commenting on HBF’s potential, Patterson said: “HBF shows the promise of playing an important role in datacenter AI by delivering unprecedented memory capacity at high bandwidth, enabling inference workloads to scale far beyond today’s constraints.”

Raja Koduri, a former senior executive at AMD and Intel and now CEO of Oxmiq Labs, brings extensive expertise in GPU and AI hardware architecture. He led the development of several major graphics platforms, including AMD’s Polaris and Intel’s Arc. Koduri sees HBF as a key enabler for edge AI, stating: “This advancement will unlock a new era of intelligent edge applications, fundamentally changing how and where AI inference is performed.”

Unveiled during SanDisk’s 2025 Investor Day, HBF is designed to augment High Bandwidth Memory (HBM), delivering up to 8x the capacity at similar cost and comparable bandwidth. Built using BiCS and CBA wafer bonding technology, HBF features a 16-high stacked configuration with ultra-low die warpage. The technology has been in development for over a year in collaboration with major AI players.

With HBF, SanDisk aims to redefine memory infrastructure for an AI-driven future — bridging capacity and bandwidth challenges across both cloud and edge environments.