Renesas Mobile Corporation has announced the third generation of its GSM/HSPA+/LTE FDD/ LTE TDD multi-mode modems SP2532 .The modem offers provides solution to OEMs by reducing R&D efforts and risks.
The SP2532delivers high speed broadband on the go, and is able to deliver sustained Cat-4 throughputs of 150Mbits download and 50Mbits upload for both smart phones and data centric devices. The SP2532 comprises a integrated base band modem, an RF subsystem containing the RF integrated chip, front end module, a power amplifier and a power management sub-system. The modem enables the customers to leverage their existing software and hardware assets while upgrading to LTE.
Heikki Tenhunen, Senior Vice President, Renesas Mobile Corporation said, “This next generation slim modem platforms, the SP2532 will allow OEMs to design compelling mobile devices which take advantage of lightening quick throughput and low latency for interactive games, rapid web browsing and video streaming and data-rich enterprise application. In addition to enabling exciting new use cases at the lowest power possible, the small chipset footprint also offers the possibility to create new form factors and supports all key operator requirements for 2013 and 2014 including VoLTE, SRVCC and OTDOA.”
SP2532 can achieve efficient power consumption enabling users to stay connected for longer on a battery charge.
