TCS announces chiplet services for semiconductors

Tata Consultancy Services has announced the launch of its Chiplet-based System Engineering Services. This offering is aimed at supporting semiconductor companies in advancing beyond the limitations of traditional chip design. By leveraging chiplets small integrated circuits that function as modular building blocks TCS aims to help chipmakers produce faster, more efficient, and higher-performing processors, at a time when global demand for semiconductors is increasing significantly.

The launch comes at a time for India, whose semiconductor market is valued at an estimated Rs 45–50 billion for 2024–25. Projections indicate that it could grow to Rs 100–110 billion by 2030. The Indian government is backing this growth through the Rs 76,000 crore India Semiconductor Mission, which seeks to position the country as a global centre for chip design and manufacturing.

India already accounts for 20% of the world’s chip design engineers, and several international firms are investing in domestic manufacturing and assembly operations. TCS’ new services are expected to further support this ecosystem, offering both Indian and international companies access to specialized expertise in chip-to-system engineering.

Commenting on the launch, V Rajanna, President, Technology, Software and Services at TCS, said, “Semiconductors are foundational to digital innovation. Our Chiplet-based System Engineering Services will help semiconductor enterprises accelerate chiplet tapeouts, offering greater flexibility, scalability, and quicker time to market. TCS’ investments in next-generation technologies, in-depth industry knowledge, and execution capabilities position us as a strong partner for innovation at scale.”

TCS’ Chiplet-based System Engineering Services include comprehensive design and verification for industry standards such as UCIe (Universal Chiplet Interconnect Express) and HBM (High Bandwidth Memory). 

The company also offers advanced packaging design capabilities, including 2.5D and 3D interposers and multi-layer organic substrates, materials essential for connecting and supporting multi-chip packages. These services enable clients to develop next-generation multi-chip products with enhanced signal integrity, reduced latency, and smaller form factors.