Intel, Odisha government to set up $3.3 billion semiconductor materials facility in India

Intel signed a pact with 3D Glass Solutions (3DGS) and the Odisha government to set up a $3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region. The government said in a press note that Intel will support the project with technology know-how and process expertise.

The proposed project is among the largest high-technology manufacturing investments in the country, particularly in the semiconductor space. The facility will focus on substrate manufacturing, a critical material and process technology used for mounting semiconductor chips on motherboards.

The project, to be implemented in phases over the next five to six years, is expected to generate around 1,800 highly skilled jobs. The facility will focus on substrate manufacturing, a critical material and process technology used for mounting semiconductor chips on motherboards.

Union Minister Ashwini Vaishnaw welcomed the announcement in a post on X, congratulating the Odisha government, Intel and 3DGS on signing the agreement. “This will further advance semiconductor ecosystem in India,” Vaishnaw said.

The development marks a significant step in India’s efforts to strengthen its semiconductor ecosystem and expand domestic chip manufacturing capabilities.